Wiring terminal-connecting adhesive

ABSTRACT

A wiring structure having a wiring-terminal-connection adhesive that includes a curing agent capable of generating a free radical upon heating, a radically polymerizable substance and silicone particles.

This application is a Divisional application of application Ser. No.11/074,704, filed Mar. 9, 2005 now U.S. Pat. No. 7,777,335, which is aDivisional application of application Ser. No. 10/069,273, submitted May23, 2002, now U.S. Pat. No. 6,939,913, issued Sep. 6, 2005, which is anapplication submitted under 35 USC §371 of International (PCT)Application No. PCT/JP00/05766, filed Aug. 25, 2000. The contents of No.10/069,273, submitted May 23, 2002, are incorporated herein by referencein their entirety. This application is related to application Ser. No.11/074,718, filed Mar. 9, 2005, now U.S. Pat. No. 7,241,644, issued Jul.10, 2007.

TECHNICAL FIELD

This invention relates to a wiring-connecting adhesive, and awiring-terminal-connecting method and a wiring structure which make useof such an adhesive.

BACKGROUND ART

In recent years, wiring density is being made higher in the field ofprecision electronic machinery, so that electrodes are formed in verysmall width and distance. Hence, there is a possibility that the wiringmay fall off, come off or come to misregistration. To solve thisproblem, adhesive compositions for electric and electronic use whichhave a good low-temperature curability and having a pot life have beendeveloped (e.g., Japanese Patent Application Laid-open No. 11-97825).

However, conventional wiring and connecting members have had a problemthat they differ in bond strength depending on the type of materialsconstituting the wiring to be connected. In particular, where thesubstrate which supports wiring terminals is made of an insulatingorganic material such as polyimide resin, or glass, or where siliconnitride, silicone resin or polyimide resin is coated or stays attachedat the surface of a wiring member, there has been the problem of a verylow bond strength.

DISCLOSURE OF THE INVENTION

An object of the present invention it to provide an adhesive which issuited for electric and electronic use and can achieve a high bondstrength especially even when it bonds a wiring member in which thesubstrate which supports wiring terminals is made of an insulatingorganic matter or glass, or a wiring member having silicon nitride,silicone resin and/or polyimide resin at its surface at least in part,and provide a wiring-terminal-connecting method and a wiring structurewhich make use of such an adhesive.

The present invention provides a wiring-terminal-connecting adhesivecomprising (1) a curing agent capable of generating a free radical uponheating, (2) a radically polymerizable substance and (3) siliconeparticles. The adhesive of the present invention can be used to connectterminals electrically by interposing the adhesive between wiringsubstrates which are so disposed that wiring terminals provided on theirsurfaces face to one another, and heating these wiring substrates underapplication of a pressure. In the present invention, the terminals mayalso be electrodes.

The adhesive of the present invention may further comprise (4) afilm-forming material. As the film-forming material, phenoxy resin ispreferred.

The adhesive of the present invention may still further comprise (5)conductive particles. The conductive particles may preferably becomposed of at least one of gold, silver and a platinum group metal atleast at their surfaces.

The silicone particles in the adhesive of the present invention maypreferably be contained in an amount of from 5 to 200 parts by weightbased on 100 parts by weight of the radically polymerizable substance(when the film-forming material is contained, based on 100 parts byweight of the total of the radically polymerizable substance and thefilm-forming material).

The silicone particles used in the adhesive of the present invention mayalso preferably have a modulus of elasticity of from 0.1 to 100 MPa at25° C. (room temperature).

The present invention also provides a wiring-terminal-connectingadhesive film comprising a first layer formed of a compositioncontaining (1) a curing agent capable of generating a free radical uponheating, (2) a radically polymerizable substance and (3) siliconeparticles; and a second layer formed of a composition containing (5)conductive particles, (2) a radically polymerizable substance and (3)silicone particles, wherein the first and second layers are formed inlayers.

The present invention still also provides a method of connecting wiringterminals, comprising interconnecting connecting terminals electricallywith the adhesive of the present invention, wherein at least two wiringmembers have the connecting terminal individually.

The connecting method of the present invention is a method in which afirst wiring member having a first connecting terminal and a secondwiring member having a second connecting terminal which are so disposedthat the terminals face to each other in the state the adhesive of thepresent invention is interposed between them are heated underapplication of a pressure in the direction of bonding to connect thefirst connecting terminal and the second connecting terminalelectrically.

The connecting method of the present invention is especially suited whenat least one of the connecting terminals has a surface which is formedof at least one of gold, silver, tin, a platinum group metal and/orindium-tin oxide (ITO). The connecting method of the present inventionis also suited when at least one of the wiring members has a substratecomprising an insulating organic material and/or glass. Moreover, theconnecting method of the present invention can achieve a superior bondstrength even when at least one of the wiring members has at least oneof silicon nitride, silicone resin and polyimide resin at its surface.

The present invention further provides a wiring structure comprising atleast two wiring members which have a connecting terminal individually,wherein the connecting terminals of the wiring members are electricallyinterconnected with the adhesive of the present invention.

The wiring structure of the present invention has a structure in which afirst wiring member having a first connecting terminal and a secondwiring member having a second connecting terminal are so disposed thatthe first connecting terminal and the second connecting terminal face toeach other in the state the adhesive of the present invention isinterposed between them, and the first connecting terminal and thesecond connecting terminal are electrically connected.

BRIEF DESCRIPTION OF THE DRAWINGS

FIGS. 1 and 2 are illustrations showing the steps of connecting wiringterminals.

FIG. 3 shows an embodiment of the present invention, of awiring-terminal-connecting adhesive containing silicone particles,conductive particles and filler.

FIG. 4 shows another embodiment of the present invention, of awiring-terminal-connecting adhesive, e.g., urethane acrylate and acuring agent capable of generating a free radical upon heating, withsilicone particles incorporated therein.

FIG. 4 shows an embodiment of the present invention, i.e., adhesive 13which includes urethane acrylate as a radically polymerizable substance,and also includes a curing agent capable of generating a free radicalupon heating. The composition also includes silicone particles 28.

BEST MODES FOR PRACTICING THE INVENTION (1) Curing Agent Capable ofGenerating a Free Radical Upon Heating

The curing agent capable of generating a free radical upon heating,contained in the adhesive of the present invention, is a substance whichundergoes decomposition upon heating to generate a free radical, asexemplified by a peroxide or an azo compound. This curing agent mayappropriately be selected taking account of the intended connectingtemperature, connecting time, pot life and so forth. In view of thehighness of reactivity and the length of pot life, the curing agent maypreferably be an organic peroxide having a temperature of 40° C. orabove for the 10-hour half-life and a temperature of 180° C. or belowfor the 1-minute half-life, and more preferably an organic peroxidehaving a temperature of 60° C. or above for the 10-hour half-life and atemperature of 170° C. or below for the 1-minute half-life.

When connected in a time of 10 seconds or less, the curing agent maypreferably be mixed in an amount of from 0.1 to 30 parts by weight, andtore preferably from 1 to 20 parts by weight, based on 100 parts byweight of the radically polymerizable substance (when the film-formingmaterial is contained, based on 100 parts by weight of the total of theradically polymerizable substance and the film-forming material) inorder to achieve a sufficient rate of reaction. If the curing agent ismixed in an amount of less than 0.1 part by weight, any sufficient rateof reaction cannot be achieved to tend to make it difficult to achieve agood bond strength and a low connection resistance. If it is mixed in anamount of more that 30 parts by weight, the adhesive may have a lowflowability or a high connection resistance, and the adhesive tends tohave a short lifetime.

Curing agents preferable for the present invention may include diacylperoxides, peroxydicarbonates, peroxy esters, peroxy ketals, dialkylperoxides, hydroperoxides and silyl peroxides.

In order to keep the connecting terminals of the wiring member fromcorroding, any chloride ion or organic acid contained in the curingagent may preferably be not more than 5,000 ppm. Those in which anyorganic acid generated after thermal decomposition can be in a smallcontent are more preferred. Stated specifically, peroxy esters, dialkylperoxides, hydroperoxides, silyl peroxides, and the like are preferred.In particular, it is preferable to select the curing agent from peroxyesters, which can achieve a high reactivity. Of these curing agents, anyone compound may be used alone, or two or more compounds may be used inappropriate combination.

Peroxy esters preferable for the present invention may include cumylperoxyneodecanoate, 1,1,3,3-tetramethylbutyl peroxyneodecanoate,1-cyclohexyl-1-methylethyl peroxyneodecanoate, t-hexylperoxyneodecanoate, t-butyl peroxypivarate, 1,1,3,3-tetramethylbutylperoxy-2-ethylhexanonate,2,5-dimethyl-2,5-di(2-ethylhexanoylperoxy)hexane,1-cyclohexyl-1-methylethyl peroxy-2-ethylhexanonate, t-hexylperoxy-2-ethylhexanonate, t-butyl peroxy-2-ethylhexanonate, t-butylperoxyisobutyrate, 1,1-bis(t-butylperoxy)cyclohexane, t-hexylperoxyisopropylmonocarbonate, t-butyl peroxy-3,5,5-trimethylhexanonate,t-butyl peroxylaurate, 2,5-dimethyl-2,5-di(m-toluoylperoxy)hexane,t-butyl peroxyisopropylmonocarbonate, t-butylperoxy-2-ethylhexylmonocarbonate, t-hexyl peroxybenzoate, t-butylperoxyacetate and the like.

Dialkyl peroxides preferable for the present invention may includeα,α′-bis(t-butylperoxy) diisopropylbenzene, dicumyl peroxide,2,5-dimethyl-2,5-di(t-butylperoxy)hexane, t-butyl cumyl peroxide and thelike.

Hydroperoxides preferable for the present invention may includediisopropylbenzene hydroperoxide, cumene hydroperoxide, and the like.

Diacyl peroxides preferable for the present invention may includeisobutyl peroxide, 2,4-dichlorobenzoyl peroxide, 3,5,5-trimethylhexanoylperoxide, octanoyl peroxide, lauroyl peroxide, stearoyl peroxide,succinic peroxide, benzoyl peroxytoluene, benzoyl peroxide and the like.

Peroxydicarbonates preferable for the present invention may includedi(n-propyl) peroxydicarbonate, di(isopropyl) peroxydicarbonate,bis(4-t-butylcyclohexyl) peroxydicarbonate, di(2-ethoxyethyl)peroxydicarbonate, di(2-ethylhexyl) peroxydicarbonate, di(methoxybutyl)peroxydicarbonate, di(3-methyl-3-methoxybutyl) peroxydicarbonate and thelike.

Peroxy ketals may include1,1-bis(t-hexylperoxy)-3,3,5-trimethylcyclohexane,1,1-bis(t-hexylperoxy)cyclohexane,1,1-bis(t-butylperoxy)-3,3,5-trimethylcyclohexane,1,1-bis(t-butylperoxy)cyclododecane, 2,2-bis(t-butylperoxy)decane andthe like.

Silyl peroxides may include t-butyltrimethylsilyl peroxide,bis(t-butyl)dimethylsilyl peroxide, t-butyltrivinylsilyl peroxide,bis(t-butyl)divinylsilyl peroxide, tris(t-butyl)vinylsilyl peroxide,t-butyltriallylsilyl peroxide, bis(t-butyl)diallylsilyl peroxide,tris(t-butyl)allylsilyl peroxide and the like.

Of these curing agents capable of generating free radicals upon heating,any one compound may be used alone, or two or more compounds may be usedin combination. Also, any of these curing agents may be used incombination with a decomposition accelerator, an inhibitor and so forth.

These curing agents may be coated with a polyurethane type or polyestertype polymeric compound so as to be made into microcapsules. Such curingagents are also preferable for the present invention because the potlife can be made longer.

(2) Radically Polymerizable Substance

The radically polymerizable substance to be contained in the adhesive ofthe present invention is a substance having a functional group which canpolymerize by the action of radicals. This radically polymerizablesubstance may include acrylates, methacrylates maleimide compounds andthe like, which may be in the state of either of monomers and oligomers.A monomer and an oligomer may also be used in combination.

As specific examples of acrylates and methacrylates preferable for theadhesive of the present invention, they may include methyl acrylate,ethyl acrylate, isopropyl acrylate, isobutyl acrylate, ethylene glycoldiacrylate, diethylene glycol diacrylate, trimethylolpropanetriacrylate, tetramethylolmethane tetraacrylate,2-hydroxy-1,3-diacryloxypropane,2,2-bis[4-(acryloxymethoxy)phenyl]propane,2,2-bis[4-(acryloxypolyethoxy)phenyl]propane, dicyclopentenyl acrylate,tricyclodecanyl acrylate, tris(acryloyloxyethyl) isocyanurate, urethaneacrylate, etc., and rethacrylates corresponding to these.

Maleimide compounds preferable for the adhesive of the present inventionare those having at least two maleimide groups in the molecule. Suchmaleimide compounds may include, e.g., 1-methyl-2,4-bismaleimidobenzene,N,N′-m-phenylenebismaleimide, N,N′-p-phenylenebismaleimide,N,N′-m-toluoylenebismaleimide, N,N′-4,4-biphenylenebismaleimide,N,N′-4,4-(3,3′-dimethyl-biphenylene)bismaleimide,N,N′-4,4-(3,3′-dimethyldiphenylmethane)bismaleimide,N,N′-4,4-(3,3′-diethyldiphenylmethane)bismaleimide,N,N′-4,4-diphenylmethanebismaleimide,N,N′-4,4-diphenylpropanebismaleimide,N,N′-3,3′-diphenylsulfonebismaleimide, N,N′-4,4-diphenyl etherbismaleimide, 2,2-bis{4-(4-maleimidophenoxy)phenyl}propane,2,2-bis{3-s-butyl-4,8-(4-maleimidophenoxy)phenyl}propane,1,1-bis{4-(4-maleimidophenoxy)phenyl}decane,4,4′-cyclohexylidene-bis{11-(4-maleimidophenoxy)phenyl}-2-cyclohexylbenzene,2,2-bis{4-(4-maleimidophenoxy)phenyl}hexafluoropropane and the like.

Of these radically polymerizable substances, compounds having at leastone of a dicyclopentenyl group, a tricyclodecanyl group and a triazinering are preferred because adhesive cured products can be improved inheat resistance.

Of these radically polymerizable substances, any one may be used aloneor two or more may be used in combination. If necessary, apolymerization inhibitor such as hydroquinones or methyl etherhydroquinones may appropriately be used.

The radically polymerizable substance described above may also be usedin combination with a radically polymerizable substance having aphosphoric ester structure represented by the following chemical formula(I). This is preferable because the bond strength on the surface ofinorganic matter such as metal is improved.

wherein n is 1, 2 or 3.

Such a radically polymerizable substance having a phosphoric esterstructure can be obtained by allowing phosphoric anhydride to react with2-hydroxyethyl acrylate or methacrylate. It may specifically includemono(2-methacryloyloxyethyl) acid phosphate, di(2-methacryloyloxyethyl)acid phosphate and the like. Of these, any one compound may be usedalone, or two or more may be used in combination.

The radically polymerizable substance having a phosphoric esterstructure may preferably be mixed in an amount of from 0.01 to 50 partsby weight, and more preferably from 0.5 to 5 parts by weight, based on100 parts by weight of the total weight of the radically polymerizablesubstance(s) (when the film-forming material is contained, based on 100parts by weight of the total of the radically polymerizable substance(s)and the film-forming material). If it is less than 0.01 part by weight,the bond strength to the surface of inorganic matter such as metal maybe improved with difficulty. If it is more than 50 parts by weight, theexpected curing performance may not be achieved.

(3) Silicone Particles

The silicone particles may be obtained by a method in which, e.g., asilane compound (such as a methyltrialkoxysilane or a partialhydrolysis-condensation product thereof) is added to an aqueous alcoholsolution the pH of which has been adjusted with sodium hydroxide orammonia to more than 9 and the mixture formed is hydrolyzed to effectpolycondensation, or may be obtained by, e.g., copolymerization of anorganosiloxane.

In the adhesive of the present invention, silicone particles having afunctional group such as a hydroxyl group, an epoxy group, a ketimine, acarboxyl group or a mercapto group at the molecular terminal or on theside chain in the molecule are preferred because the dispersibility inthe film-forming material and radically polymerizable substance (s) canbe improved.

In the present invention, the incorporation of the silicone particles inthe adhesive enables achievement of a very high bond strength even onthe wiring member in which the substrate which supports connectingterminals is made of an insulating organic matter or glass, or on thewiring member having silicon nitride, silicone compound or polyimideresin at its surface. Also, in the case when the adhesive is made into afilm by the use of the film-forming material, the film is improved inits releasability from a base material, and hence is improved intransfer performance on electronic materials which are to be bonded withsuch a film adhesive.

In the present invention, spherical or amorphous fine particles may beused as the silicone particles, and fine particles with an averageparticle diameter of from 0.1 μm to 20 μm may preferably be used. Alsopreferred are silicone particles in which particles not larger than theaverage particle diameter hold 80% by weight or more of the particlesize distribution of the fine particles. Silicone particles the particlesurfaces of which have been treated with a silane coupling agent areparticularly preferred because the dispersibility in the resin isimproved.

The silicone particles used in the adhesive of the present invention maypreferably have a modulus of elasticity of from 0.1 to 100 MPa at roomtemperature (25° C.), and more preferably from 1 to 30 MPa in order toimprove the dispersibility of the particles or to lessen the interfacialstress acting at the time of connection. Incidentally, the modulus ofelasticity as defined herein is the modulus of elasticity of siliconerubber obtained by polymerizing the silane compound (such as analkoxysilane or a partial hydrolysis-condensation product thereof) whichis a material for the silicone particles, and is measured by dynamicextended viscoelastometry.

The silicone particles may directly be mixed in the radicallypolymerizable substance, the curing agent capable of generating a freeradical upon heating or the film-forming material. Since, however, theformer is readily dispersible in the film-forming material or radicallypolymerizable substance, the former may preferably be mixed with thelatter after the former has been dispersed in an organic solvent.

The silicone particles may be mixed in an amount of from 5 to 200 partsby weight, and more preferably from 10 to 50 parts by weight, based on100 parts by weight of the total weight of the radically polymerizablesubstance(s) (when the film-forming material is contained, based on 100parts by weight of the total of the radically polymerizable substances)and the film-forming material). If the silicone particles are less than5 parts by weight, the good bond strength to the substrate whichsupports connecting terminals and to the wiring member surface and thereleasability from the base material may be less achievable. If on theother hand the silicone particles are more than 200 parts by weight, theadhesive may have a low cohesive force and hence there is a possibilitythat any good adhesive can not be obtained.

(4) Film-Forming Material

Film-forming materials preferable for the present invention may includepolyvinyl formal resin, polystyrene resin, polyvinyl butyral resin,polyester resin, polyamide resin, xylene resin, phenoxy resin andpolyurethane resin.

The film-forming material refers to a material which can make theadhesive be handled as a film in a usual condition when a liquidcomposition is solidified into a film, i.e., a material which impartsgood mechanical properties as film (the properties that the film formedcan be handled with ease and the film does not split, break or becometacky) to the film to be formed. In view of the readiness to handle as afilm, a material capable of forming a self-supporting film is preferred.

Among compounds which can impart such properties, it is preferable touse phenoxy resin, as having superior adhesion, compatibility, heatresistance and mechanical strength. The phenoxy resin is obtained byallowing a bifunctional phenol to react with an epihalohydrin to aproduct with a high molecular weight, or by subjecting a bifunctionalepoxy resin and a bifunctional phenol to polyaddition.

Stated specifically, it can be obtained by, e.g., allowing 1 mol of abifunctional phenol to react with 0.985 to 1.015 mol of an epihalohydrinin the presence of an alkali metal hydroxide in an inactive solvent at40 to 120° C.

From the viewpoint of the mechanical properties and thermal propertiesof the resin, particularly preferred is a product obtained by subjectingto polyaddition reaction a bifunctional epoxy resin and a bifunctionalphenol in a mixing equivalent ratio of epoxy group/phenol hydroxylgroup=1/0.9 to 1/1.1, in the presence of a catalyst such as an alkalimetal compound, an organic phosphorus compound or a cyclic aminecompound, in an organic solvent of an amide type, an ether type, aketone type, a lactone type or an alcohol type, having a boiling pointof 120° C. or above, in a reaction solid content of 50 parts by weightor less, and with heating at 50 to 200° C.

The bifunctional epoxy resin may include bisphenol A epoxy resin,bisphenol F epoxy resin, bisphenol AD epoxy resin and bisphenol S epoxyresin. The bifunctional phenol is a compound having two phenolichydroxyl groups, and may include, e.g., hydroquinones and bisphenolssuch as bisphenol A, bisphenol A, bisphenol AD and bisphenol S. Thephenoxy resin may be modified with a radically polymerizable functionalgroup.

(5) Conductive Particles

The adhesive of the present invention need not particularly containconductive particles because the electrical conduction is attained bydirect contact of the wiring terminals to be connected. The conductiveparticles may preferably be contained because more stable connection canbe attained.

Conductive particles preferable for the present invention may includeparticles of metals such as Au, Ag, Ni, Cu and solder, and carbonparticles. In order to achieve a sufficient pot life, it is preferablethat not a transition metal such as Ni or Cu but a noble metal such asAu, Ag or a platinum group metal forms their surface layers. It isparticularly preferable that the surface is formed of Au. Particlescomprised of a transition metal such as Ni the particle surfaces ofwhich have been coated with a noble metal such as Au are also preferablefor the present invention.

Composite particles comprised of non-conductive glass, ceramic orplastic particles on the surfaces of which conductive layers formed ofthe above metal have been formed to provide outermost layers formed of anoble metal, and heat-fusible metal particles are also suited for thepresent invention because they are deformable upon application of heatand pressure and hence the area of their contact with electrodesincreases at the time of connection to bring about an improvement inreliability.

In the case when the composite particles having coat layers of a noblemetal at the surfaces are used, the coat layers may preferably beprovided in a thickness of 100 angstroms or more in order to attain agood resistance. Especially when the layers of a noble metal areprovided on the transition metal such as Ni, the coat layers formed of anoble metal may preferably be provided in a thickness of 300 angstromsor more in order to prevent free radicals from being generated by theredox reaction caused by any defects of the noble metal layers whichdefects may occur when the conductive particles are mixed and dispersed,to cause a lowering of storage stability. If, however, the coat layersare provided in a thickness larger than 1 μm, the effect is no longerimproved in proportion to the thickness. Hence, in usual cases, it ispreferable for the coat layers to be in a thickness of 1 μm or less, towhich, however, the present invention is by no means limited.

The conductive particles may properly be used according to purpose, inthe range of from 0.1 to 30 parts by volume based on 100 parts by volumeof the resin component of the adhesive. In order to prevent adjoiningwirings from being short-circuited by any excess conductive particles,the conductive particles may more preferably be used in an amount offrom 0.1 to 10 parts by volume.

Structure in which the conductive particles are not in contact with thecuring agent enables more improvement of pot life. More specifically, anadhesive film having a double or more multi-layer structure in which atleast a first layer formed of the adhesive of the present invention anda second layer formed of an adhesive mixed with the conductive particlesin place of the curing agent are formed in layers is preferred because amuch longer pot life can be achieved.

(6) Other Additives

In the adhesive of the present invention, allyl acrylate and/or allylmethacrylate may optionally be mixed in order to improve bond strength.It or they may be mixed in an amount of from 0.1 to 10 parts by weight,and more preferably from 0.5 to 5 parts by weight, based on 100 parts byweight of the total weight of the radically polymerizable substance(s)(when the film-forming material is contained, based on 100 parts byweight of the total of the radically polymerizable substance(s) and thefilm-forming material). If it is less than 0.1 part by weight, theeffect of improving bond strength may not sufficiently be achieved. Ifit is more than 10 parts by weight, the radical polymerization reactionmay be so low as to cause insufficient reaction to make it difficult toachieve good bond strength.

In the adhesive of the present invention, a polymer or copolymer havingas a monomer component at least one of acrylic acid, an acrylate, amethacrylate and acrylonitrile may also be mixed. In particular, acopolymer acrylic rubber containing glycidyl acrylate and/or glycidylmethacrylate monomer(s) having a glycidyl ether group promises superiorstress relaxation, and may preferably be contained. Such an acrylicrubber may preferably have a weight-average molecular weight of 200,000or more in order to make the adhesive have a higher cohesive force.

In the adhesive of the present invention, a filler, a softening agent,an accelerator, an anti-aging agents, a colorant, a flame retardant, athixotropic agent, a coupling agent, a resin (e.g., phenolic resin ormelamine resin) and an isocyanate may further be mixed.

The mixing of the filler is preferable because the connectionreliability and so forth are improved. In the case when the filler isused, the maximum diameter of its particles should be smaller than theparticle diameter of the conductive particles. Also, it may be mixed inan amount of from 5 to 60 parts by volume based on 100 parts by volumeof the resin component in the adhesive. If it is more than 60 parts byvolume, the effect of improving reliability may be saturated. If it isless than 5 parts by volume, its addition is less effective.

FIG. 3 shows an embodiment of the present invention, wherein theadhesive also includes a filler. That is, adhesive 13 includesconductive particles 14, silicone particles 28 and filler 29, accordingto an embodiment of the present invention, with a maximum diameter ofthe filler being smaller than the particle diameter of the conductiveparticles.

As the coupling agent, any of ketimine-, vinyl-group-, acrylic-group-,amino-group-, epoxy-group- and isocyanate-group-containing agents arepreferable for the present invention in view of an improvement inadhesion.

As a silane coupling agent having an amino group, it may include, e.g.,N-β-(aminoethyl)γ-aminopropyltrimethoxysilane,N-β-(aminoethyl)γ-aminopropylmethyldimethoxysilane,γ-aminopropyltriethoxysilane, N-phenyl-γ-aminopropyltrimethoxysilane andthe like.

As a silane coupling agent having a ketimine, it may include thoseobtained by allowing the above silane coupling agent having an aminogroup, to react with a ketone compound such as acetone, methyl ethylketone or methyl isobutyl ketone.

(7) Uses

The adhesive of the present invention may also be used as an adhesivefilm used to bond IC (integrated circuit) chips to chip-mount-substratesor to bond electric wirings to one another. More specifically, theadhesive of the present invention which has been shaped into a film (theadhesive film) may be interposed between a first wiring member having afirst connecting terminal and a second wiring member having a secondconnecting terminal, and these may be heated and pressed to connect thefirst connecting terminal and the second connecting terminalelectrically.

Wiring members preferable as members to be connected according to thepresent invention may include chip component parts such as semiconductorchips, resistor chips and capacitor chips, and substrate members such asprinted-wiring substrates. These wiring members are provided withconnecting terminals usually in a large number (may be provided with oneterminal in some cases). At least one set of such wiring members is sodisposed that at least part of wiring terminals provided thereon face toone another, interposing the adhesive of the present invention betweenthese, which are then heated under application of a pressure toelectrically interconnect the connecting terminals facing to oneanother. Thus, a wiring structure (such as a wiring board) having two ormore wiring members can be manufactured. Here, the electrical conductionbetween wiring terminals thus formed may be set up by direct contactbetween the wiring terminals or may be set up via the conductiveparticles contained in the adhesives.

The connection of wiring terminals according to the present inventionmay be performed by, e.g., forming an adhesive layer on the surface ofthe first connecting terminal (circuit electrode), and disposing on thesurface of this adhesive layer the second connecting terminal (circuitelectrode) under registration in such a way that the connectingterminals face to each other, followed by heating and pressing. Theadhesive layer may be formed by, e.g., coating a liquid adhesive, or maybe formed by placing the adhesive film.

(8) Physical Properties of Adhesive

The adhesive of the present invention melts and flows at the time ofconnection to connect wiring terminals facing to one another, andthereafter it is cured to keep the connection. Hence, the flowability ofthe adhesive is an important factor. The adhesive of the presentinvention may preferably have a flowability of from 1.3 to 3.0, and morepreferably from 1.5 to 2.5, as the value of flowability (B)/(A)represented by the initial area (A) and the area (B) after heating andpressing when the adhesive of the present invention which is of 35 μm inthickness and 5 mm×5 mm in size is interposed between two sheets ofglass of 0.7 mm in thickness and 15 mm×15 mm in size and these areheated and pressed at 150° C. and 2 MPa for 10 seconds. If the value issmaller than 1.3, the adhesive may have so poor a flowability as not toachieve any good connection. If it is greater than 3.0, air bubbles mayoccur to result in a poor reliability.

The adhesive of the present invention may also preferably have a modulusof elasticity of from 100 to 3,000 MPa at 25° C. after coring, and morepreferably from 300 to 2,000 MPa. When it has the modulus of elasticityin this range, the resin can have a low internal stress afterconnection. Hence, this is advantageous for the improvement of adhesiveforce, and also can ensure good conduction performance.

The adhesive of the present invention may preferably have, inmeasurement with a differential scanning calorimeter (DSC) at a heatingrate of 10° C./minute, an exotherm rise temperature (Ta) of from 70° C.to 10° C., a peak temperature (Tp) of Ta+5 to 30° C. and an endtemperature (Te) of 160° C. or below.

EXAMPLES A. Preparation of Adhesive Example 1 (1) Synthesis of UrethaneAcrylate

400 parts by weight of polycaprolactone diol with an average molecularweight of 800, 131 parts by weight of 2-hydroxypropyl acrylate, 0.5 partby weight of dibutyltin dilaurate as a catalyst and 1.0 part by weightof hydroquinone monomethyl ether as a polymerization inhibitor wereheated to 50° C. with stirring to mix them. Next, 222 parts by weight ofisophorone diisocyanate was dropwise added thereto, and the mixtureformed was further heated to 80° C. with stirring to effect urethanationreaction. Having made sure that the conversion of isocyanate groupsreached 99% or more, the reaction temperature was dropped to obtainurethane acrylate A.

(2) Synthesis of Silicone Particles

Silicone particles were obtained by adding methyltrimethoxysilane to anaqueous alcohol solution of pH 12 and kept at 20° C., with stirring at300 rpm to effect hydrolysis and condensation. The silicone particlesthus obtained had a modulus of elasticity of 8 MPa at 25° C. and anaverage particle diameter of 2 μm.

(3) Preparation of Conductive Particles

Conductive particles were prepared by providing nickel layers of 0.2 μmthick on the surfaces of particles composed of polystyrene as nuclei,and providing gold layers of 0.04 μm thick on the outsides of the nickellayers. The conductive particles thus obtained had an average particlediameter of 10 μm.

(4) Preparation of Adhesive

100 parts by weight of the silicone particles obtained in the step (2)were dispersed in 100 parts by weight of a mixed solvent oftoluene/ethyl acetate of 50/50 in weight ratio.

The urethane acrylate A obtained in the step (1), a phosphate typeacrylate (available from Kyoeishayushi Kabushiki Kaisya; tradename:P2M), the silicone particles and t-hexyl peroxy-2-ethylhexanonate (afree radical generator) were so mixed as to be in amounts of 99 g, 1 g,30 g and 5 g, respectively, in solid weight ratio, and 3% by volume ofthe conductive particles obtained in the step (3) were dispersed toobtain a liquid adhesive.

Example 2

50 g of phenoxy resin (available from Union Carbide Corporation; tradename: PKHC; average molecular weight: 45,000) was dissolved in a mixedsolvent of toluene (boiling point: 110.6° C.; SP value; 8.90)/ethylacetate (boiling point: 77.1° C.; SP value; 9.10) of 50/50 in weightratio to form a solution with a solid content of 40% by weight.

The phenoxy resin, the urethane acrylate A, the phosphate type acrylate,the t-hexyl peroxy-2-ethylhexanonate and the silicone particles were somixed as to be in amounts of 50 g, 49 g, 1 g, 5 g and 5 g, respectively,in solid weight ratio, and 3% by volume of the conductive particles weredispersed.

The dispersion thus obtained was coated on a one-side surface-treatedPET (polyethylene terephthalate) film of 80 μm thick by means of acoater, followed by drying with 70° C. hot air for 10 minutes to obtainan adhesive film of 20 μm thick.

Examples 3 to 5

Adhesive films were obtained in the same manner as in Example 2 exceptthat the solid weight ratio of phenoxy resin/urethane acrylateA/phosphate type acrylate/silicone particles/t-hexylperoxy-2-ethylhexanonate was changed to 50 g/49 g/1 g/20 g/5 g (Example3), 30 g/69 g/1 g/10 g/5 g (Example 4) and 30 g/40 g/30 g/10 g/5 g(Example 5).

Comparative Example 1

An adhesive film was obtained in the same manner as in the step (4) ofExample 1 except that the solid weight ratio of urethane acrylateA/phosphate type acrylate/t-hexyl peroxy-2-ethylhexanonate was changedto 99 g/1 g/5 g and the silicone particles were not mixed.

Comparative Example 2

An adhesive film was obtained in the same manner as in Example 2 exceptthat the silicone particles were not used.

B. Evaluation of Adhesive

(1) Production of Wiring Structure:

First, on the surface of a glass substrate 11 of 1.1 mm thick, wirings12 of indium-tin oxide (ITO) were formed by vacuum deposition to preparean ITO substrate member (surface resistivity: <20 Ω/square) 10 [FIG. 1(a)]. On its side where the wiring 12 was formed, an adhesive layer 15formed of an adhesive containing conductive particles 14 (the oneprepared in each Example and Comparative Example) was formed [FIG. 1(b)].

In Example 1 and Comparative Example 1, in which the adhesive wasliquid, the adhesive layer 15 was formed by coating the adhesive. InExamples 2 to 5 and Comparative Example 2, in which the adhesive wasfilmy, it was formed by fastening the adhesive to the wiring member,heating and pressing them at 70° C. and 0.5 MPa for 5 seconds to effectprovisional connection, and thereafter peeling the PET film off.

On the surface of this adhesive layer 15, a flexible wiring board (atriple-layer FPC) 19 was placed which was prepared by bonding apolyimide layer 18 and copper foil (thickness: 18 μm) with an adhesive17 and subjecting the copper foil to patterning to form wirings 16 of 50μm in line width and 100 μm in pitch, and these were heated and pressed(arrow 20 shows the direction of pressing) at 160° C. and 3 MPa for 10seconds to make connection over a width of 2 mm. Reference character 14a represents pressed conductive particles. Thus, a wiring structure 21shown in FIG. 1( d) was obtained.

A wiring structure 25 was also obtained [FIG. 2( b)] by makingconnection to the ITO substrate member in the same way but using, inplace of the triple-layer FPC, a flexible wiring board (a double-layerFPC) 24 prepared by forming on the surface of a polyimide film(thickeness: 100 μm) 22 a copper circuit 23 with 500 wirings of 50 μm inline width, 100 μm in pitch and 18 μm in thickness [FIG. 2 (a)].

(2) Measurement of Connection Resistance:

After the wiring structures were produced in the manner as describedabove, their resistance value between adjoining circuits of the FPCsincluding wiring-connected portions was measured with a multi-meterimmediately after the production. These were further kept in ahigh-temperature high-humidity chamber of 85° C. and 85% RH for 500hours, and thereafter the resistance value was measured in the same way.Here, the resistance value was shown as the average of 150 points ofresistance between adjoining circuits.

(3) Measurement of Bond Strength:

The wiring structures produced in the manner as described above were putto a peel test of peeling at 90 degrees at a peel rate of 50 mm/minute,to measure their bond strength.

(4) Evaluation of Insulation Properties:

First, a printed-wiring substrate having a comb-shaped circuit in whicha copper circuit with 250 wirings provided alternately in a line widthof 50 aim, a pitch of 100 μm and a thickness of 18 μm was prepared. Onits side where the circuit was formed, an adhesive layer was formed inthe same manner as the above (1).

Next, on the surface of this adhesive layer, a flexible wiring board(FPC) having a copper circuit with 500 wirings of 50 μm in line width,100 μm in pitch and 18 μm in thickness was placed, and these were heatedand pressed at 160° C. and 3 MPa for 10 seconds to make connection overa width of 2 mm. Thus, a wiring structure was obtained. To thecomb-shaped circuit of this wiring structure, a voltage of 100 V wasapplied to measure insulation resistance value. The wiring structure wasfurther put to a high-temperature high-humidity test of 85° C. and 85%RH for 500 hours, and thereafter the insulation resistance value wasmeasured.

(5) Evaluation of Flowability:

An evaluation-purpose adhesive of 5 mm×5 mm in size and 35 μm inthickness was sandwiched between two sheets of glass of 15 mm×15 nm insize and 0.7 mm in thickness, and these were heated and pressed at 150°C. and 2 MPa for 10 seconds, where the value of flowability (B)/(A) wasdetermined on the basis of the initial area (A) and the area (B) afterheating and pressing.

(6) Modulus of Elasticity after Curing:

The liquid adhesives (Example 1 and Comparative Example 1) were eachcasted into a mold, and then heated at 160° C. for 1 minute to effectcuring to obtain a rodlike cured product. The filmy adhesives (Examples2 to 5 and Comparative Example 2) were each immersed in 160° C. oil for1 minute to effect curing to obtain a film-like cured product. Thestorage elastic modulus of each of these cured products was measuredwith a dynamic viscoelastometer (heating rate: 5° C./minute; 10 Hz) todetermine the modulus of elasticity at 250C.

(7) Measurement by DSC:

Using the adhesives obtained in the respective Examples and ComparativeExamples, the rise temperature (Ta), peak temperature (Tp) and endtemperature (Te) of exothermic reaction were determined by means of adifferential scanning calorimeter (DSC, manufactured by TA InstrumentsCo.; trade name: Model 910). In the measurement, the heating rate wasset at 10° C./minute.

C. Results

The results obtained by the above evaluation methods are shown in Table1.

TABLE 1 Comparative Example Example Adhensive composition 1 2 3 4 5 1 2Adhesive Double-layer Initial stage 400 700 750 650 680 50 100 Force FPCAfter 200 400 550 450 400 10 20 (N/m) moisture absorption Triple-layerInitial stage 900 1200 1300 1100 1250 600 700 FPC After 600 900 10001000 950 300 500 moisture absorption Connection resistance Initial stage0.9 1.2 1.7 1.1 1.2 0.9 1.2 (Ω) After 1.3 1.4 1.8 1.3 1.3 1.3 1.4moisture absorption Insulation resistance (Ω) >10⁹ >10⁹ >10⁹ >10⁹ >10⁹>10⁹ >10⁹ Flowability (%) 2.5 1.9 1.7 1.8 1.9 2.6 1.8 Modulus ofelasticity (MPa) 500 800 700 800 800 600 700 DSC (° C.) Ta 88 87 90 8989 87 88 Tp 105 108 107 109 108 104 107 Te 140 148 147 147 148 143 148

The silicone particles are not contained in the adhesives of ComparativeExamples 1 and 2. In contrast thereto, in Examples 1 to 5, in which thesilicone particles are mixed, the adhesive force is greatly improvedcompared with that in Comparative Examples, even in the case of thedouble-layer FPC in which the polyimide resin stands uncovered to thesurface of the substrate which supports connecting terminals and also inthe case of the triple-layer FPC in which the adhesive stands uncoveredthereto. The adhesive force after moisture absorption is also great.

POSSIBILITY OF INDUSTRIAL APPLICATION

As described above, according to the present invention, a high bondstrength can be achieved and a wiring structure having a high connectionreliability can be produced, even in the case of the wiring member inwhich the substrate which supports wiring terminals is made of aninsulating organic matter such as polyimide resin, or glass, or in thecase of the wiring member having silicon nitride, silicone resin and/orpolyimide resin at its surface.

What is claimed is:
 1. A wiring-terminal-connecting adhesive comprising:(a) silicone particles, wherein the silicone particles have an averageparticle diameter of from 0.1 μm to 20 μm; (b) conductive particles; and(c) filler in addition to the silicone particles and conductiveparticles, wherein a maximum diameter of the filler is smaller than theparticle diameter of the conductive particles.
 2. Awiring-terminal-connecting adhesive comprising: (a) an urethaneacrylate; (b) a curing agent capable of generating a free radical uponheating; and (c) silicone particles, wherein the silicone particles havean average particle diameter of from 0.1 μm to 20 μm.
 3. Thewiring-terminal-connecting adhesive according to claim 1, whereinsurfaces of the silicone particles have been treated with a silanecoupling agent.
 4. The wiring-terminal-connecting adhesive according toclaim 2, wherein the curing agent is an organic peroxide having atemperature of 40° C. or above for the 10-hour half-life, and atemperature of 180° C. or below for the 1-minute half-life.
 5. Thewiring-terminal-connecting adhesive according to claim 2, wherein thecuring agent contains at least an organic peroxide selected from thegroup consisting of diacyl peroxides, peroxydicarbonates, peroxy esters,peroxy ketals, dialkyl peroxides, hydroperoxides and silyl peroxides. 6.The wiring-terminal-connecting adhesive according to claim 2, whereinthe curing agent contains a peroxy ester.
 7. Thewiring-terminal-connecting adhesive according to claim 2, whereinsurfaces of the silicone particles have been treated with a silanecoupling agent.
 8. The wiring-terminal-connecting adhesive according toclaim 1, which further comprises a radically polymerizable substance anda curing agent therefor.
 9. The wiring-terminal-connecting adhesiveaccording to claim 8, wherein said curing agent is a curing agentcapable of generating a free radical upon heating.
 10. Thewiring-terminal-connecting adhesive according to claim 1, wherein thesilicone particles have a functional group selected from the groupconsisting of a hydroxyl group, an epoxy group, a ketimine, a carboxylgroup and a mercapto group at a terminal position or on a side chain ofsilicone molecules of the silicone particles.
 11. Thewiring-terminal-connecting adhesive according to claim 1, wherein thesilicone particles have a modulus of elasticity of from 0.1 to 100 MPaat 25° C.
 12. The wiring-terminal-connecting adhesive according to claim2, wherein the silicone particles have a functional group selected fromthe group consisting of a hydroxyl group, an epoxy group, a ketimine, acarboxyl group and a mercapto group at a terminal position or on a sidechain of silicone molecules of the silicone particles.
 13. Thewiring-terminal-connecting adhesive according to claim 2, wherein thesilicone particles have a modulus of elasticity of from 0.1 to 100 MPaat 25° C.